Physical unclonable function (puf) chip

ABSTRACT

A physical unclonable function (PUF) chip is provided. The physical unclonable function (PUF) chip includes a chip with a top metal connection layer, an array of spaced electrode plates on the top metal connection layer of the chip, a deposition layer, on the top metal connection layer between each two adjacent electrode plates. An opening is formed between the each two adjacent electrode plates in a row, and each two adjacent electrode plates are tangential to the opening formed between the two adjacent electrode plates. The physical unclonable function (PUF) chip further includes a conductive coating layer on the chip and the conductive coating layer includes conductive particles with randomly distributed size, and a package substrate, packaged with the chip including the conductive coating layer.

CROSS-REFERENCES TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.15/850,756, filed on Dec. 21, 2017, which claims the priority of Chinesepatent application No. 201611200253.9, filed on Dec. 22, 2016, theentirety of which is incorporated herein by reference.

FIELD OF THE DISCLOSURE

The present disclosure generally relates to the field of semiconductortechnology and, more particularly, relates to a physical unclonablefunction (PUF) chip and a fabrication method thereof.

BACKGROUND

Smart cards, radio frequency (RF) identification cards, and otherphysical cards have been widely used in today's daily life. However,more complicated attacking methods have also been developed to destructchip functions in those physical cards, while more requirements areneeded to ensure digitalization security and banking security. How toprovide effective authentication has become a fundamental issue forensuring the security of data, vouchers, and financial information, of auser.

Using physical unclonable technology, personal chips may be protectedfrom data theft. Because of the inherent, unique “fingerprint” of eachsemiconductor device, encryption key may be protected without beingeasily duplicated. Users' data can thus be effectively protected.

Currently, the physical unclonable function is realized, by designing adevice or a circuit in combination with the chip production process andusing a certain process, to add uncertainty to a particular parameter ofa chip on a wafer without affecting functions of the chip and togenerate a completely unpredictable unique secure password.

However, current fabrication methods of a physical unclonable function(PUF) chip can cause low security of the chip. The disclosed device andmethod are directed to solve one or more problems set forth above andother problems.

BRIEF SUMMARY OF THE DISCLOSURE

One aspect of the present disclosure includes a method for fabricating aphysical unclonable function (PUF) chip. The fabrication methodincludes: forming an array of spaced electrode plates on a top metalconnection layer of a nude chip, while forming the top metal connectionlayer; forming a deposition layer, on the top metal connection layerbetween adjacent electrode plates; forming openings between adjacentelectrode plates in a row, each opening having a circumference tangentto the adjacent electrode plates; coating a conductive coating layer onthe nude chip, the conductive coating layer including conductiveparticles with randomly distributed size; and packaging the nude chip toprovide the PUF chip.

Another aspect of the present disclosure includes a physical unclonablefunction (PUF) chip. The PUF chip includes an array of spaced electrodeplates on a top metal connection layer of a nude chip, and a depositionlayer, on the top metal connection layer between adjacent electrodeplates. Openings are formed between adjacent electrode plates in a row,and each opening has a circumference tangent to the adjacent electrodeplates. The PUF chip also includes a conductive coating layer on thenude chip, the conductive coating layer including conductive particleswith randomly distributed size; and a package substrate, packaged withthe nude chip including the conductive coating layer.

Other aspects of the present disclosure can be understood by thoseskilled in the art in light of the description, the claims, and thedrawings of the present disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an exemplary method for fabricating a physicalunclonable function (PUF) chip consistent with various disclosedembodiments;

FIG. 2 (a) illustrates an exemplary array of electrode plates consistentwith various disclosed embodiments;

FIG. 2 (b) illustrates a partial structure of the electrode plate arrayshown in FIG. 2 (a);

FIG. 2 (c) illustrates a schematic view of an equivalent circuit of thepartial structure of the electrode plate array shown in FIG. 2 (b);

FIG. 3 illustrates a schematic view of a nude chip with openingsconsistent with various disclosed embodiments;

FIG. 4 illustrates a schematic structural view of a nude chip aftercoated with a conductive coating layer consistent with various disclosedembodiments;

FIG. 5 illustrates a schematic view of a capacitor connection stateconsistent with various disclosed embodiments;

FIG. 6 illustrates a schematic structural view of a core circuit of achip consistent with various disclosed embodiments;

FIG. 7 illustrates a schematic structural view of an exemplary physicalunclonable function (PUF) chip consistent with various disclosedembodiments.

DETAILED DESCRIPTION

Reference will now be made in detail to the exemplary embodiments of thedisclosure, which are illustrated in the accompanying drawings. Whereverpossible, the same reference numbers will be used throughout thedrawings to refer to the same or similar parts.

The present disclosure provides a physical unclonable function (PUF)chip and fabrication method. For example, when forming a top metalconnection layer of a nude chip, an array of spaced electrode plates issimultaneously formed. A deposition layer is then formed on the topmetal connection layer and between adjacent electrode plates in any row.Adjacent electrode plates along with the deposition layer form acapacitor. The fabrication method in the disclosure further includesforming openings in the deposition layer between the electrode plateswith a circumference of the openings tangent to the two electrode platesand coating a conductive coating layer made of conductive particles withrandomly distributed size on the nude chip to make the capacitorsrandomly connected. The nude chip is then packaged to provide a physicalunclonable function (PUF) chip.

The fabrication method in the present disclosure prevents chips on thesame wafer having the same capacitor connection information, such thatchips on the same wafer have different capacitor connection states andthe security of the chips is enhanced.

FIG. 1 illustrates an exemplary fabrication process of a physicalunclonable function (PUF) chip consistent with various disclosedembodiments.

In S11, while a top metal connection layer of a nude chip is formed, anarray of spaced electrode plates is formed simultaneously.

In one embodiment, a comb-like mask pattern may be provided on the topmetal connection layer of the nude chip. After an exposure process, anarray of spaced electrode plates may be formed on the top metalconnection layer of the nude chip. In other words, a top metalconnection layer including an array of spaced electrode plates isformed. The array of spaced electrode plates may also be referred to ascomb-like electrode plates. The process of forming the comb-likeelectrode plates does not require any additional steps, and the topmetal connection layer including an array of spaced electrode plates isformed simultaneously when the top metal connection layer is formed.

In one embodiment, the electrode plates in the array of spaced electrodeplates may be electrode plates of the same size.

In one embodiment, the adjacent electrode plates in any row of the arrayof spaced electrode plates may be evenly spaced apart by equalintervals.

In S12, after an array of spaced electrode plates is formed, adeposition layer is formed on the top metal connection layer.

In one embodiment, the deposition layer may be formed on the top metalconnection layer by an in-mold decoration (IMD) process. Other methodsmay also be used to form the deposition layer on the top metalconnection layer without limitation.

Because the top metal connection layer of the nude chip includes thearray of the spaced electrode plates and a deposition layer is formed ontop of the top metal connection layer. Two adjacent electrode plates inany row and the deposition layer between these two electrode plates mayform a capacitor, where the deposition layer between the electrodeplates provides a dielectric material of the capacitor. The depositionlayer may be used as a protective layer of the top metal connectionlayer to prevent oxidation of the top metal connection layer.

FIG. 2 (a) shows a schematic view of an array of electrode plates; FIG.2 (b) shows a schematic view of a partial structure of the electrodeplate array shown in FIG. 2 (a); and FIG. 2 (c) shows a schematic viewof the equivalent circuit of the partial structure of the electrodeplate array shown in FIG. 2 (b).

In an example shown in FIG. 2(a), an array of electrode plates with tworows and six columns is formed on the top metal connection layer forillustrative purposes, and a deposition layer is formed over the entiretop metal connection layer. For illustrative purposes, the electrodeplate structure shown in FIG. 2(b) takes the example of the electrodeplates located at the fifth column and the sixth column of the secondrow, that is, the electrode plates in the dashed box of FIG. 2(a).

As shown in FIGS. 2(a)-2(b), a deposition layer 21, e.g., an oxidedeposition layer, may be used as a dielectric material between electrodeplates, including a first electrode, such as a top metal connectionlayer 22 (e.g., an aluminum layer) and a second electrode, such as anadjacent top metal connection layer 23 (e.g., an aluminum layer). Thetop metal connection layers 22 and 23 may be used as upper and lowerelectrode plates. Conductive vias, such as top metallic vias 24 and 25,respectively on the top metal connection layers 22 and 23, caninternally connect the upper and lower electrode plates, so that theelectrode plates and the deposition layer between adjacent electrodeplates can be equivalent to a capacitor C1, as shown in FIG. 2 (c).

Returning to the fabrication process shown in FIG. 1, in S13, openingsare formed between adjacent electrode plates in a row. Each electrodeplate is tangent to a circumference of a corresponding opening.

In one embodiment, to facilitate wiring, an opening may be formedbetween adjacent electrode plates in a row. The circumference of theopening may touch electrode plates on opposite sides. A length directionof the opening may be in parallel with a surface of each electrodeplate. The openings may have any suitable cross-sectional shapes, forexample, having a circular or elliptical shape.

For example, FIG. 3 illustrates a schematic view of a nude chipstructure after forming openings consistent with various disclosedembodiments. As shown in FIG. 3, during a passivation process, opening31 may be formed between and on the comb-like metal line, i.e., betweenadjacent electrode plates. In some cases, such opening may be referredto as a “PA” opening.

Returning to the fabrication process shown in FIG. 1, in S14, aconductive coating layer is coated onto the nude chip.

In one embodiment, the conductive coating layer can be directly coatedto the region containing openings.

In one embodiment, the conductive coating layer including conductiveparticles may be coated in the region of the openings before packaging.In the conductive coating layer, the size of the conductive particles israndomly distributed. In some cases, the conductive particles in theopening can be randomly connected to form connecting wires and thus tobridge adjacent (e.g., upper and lower) electrode plates of thecapacitor. Due to a random size distribution of the conductiveparticles, the connecting wires may form randomly distributed bridges,allowing the capacitors to be randomly bridged. A random combination ofdifferent capacitors may be formed with strict uncertainties.

When the conductive particles have a diameter smaller than the diameterof the PA openings, the conductive particles can enter the PA openings.If 2 to 3 conductive particles are in the PA openings, the capacitorsare probable to bridge. If the diameter of the conductive particles issmaller than the diameter of the PA openings and only 1 to 2 conductiveparticles are in the PA openings, it's possible the capacitors may stillbridge. When the diameter of the conductive particles is larger than thediameter of the PA openings, the conductive particles cannot enter thePA openings and the capacitors are in a normal state.

FIG. 4 illustrates a schematic view of an exemplary nude chip structurecoated with a conductive coating layer consistent with various disclosedembodiments. As shown in FIG. 4, the conductive coating layer 41 coatedon the nude chip surface includes a number of conductive particles 42with randomly distributed sizes. When the diameter of the conductiveparticle 42 is smaller than the diameter of the opening, the conductiveparticle 42 can enter the openings, possibly forming conductiveconnections and bridging the capacitors, as shown by the region 43. Whenthe diameter of the conductive particle 42 is larger than the diameterof the opening, the conductive particle 42 cannot enter the openings andthe connecting wires may not be formed. As a result, the upper and lowerelectrode plates of the capacitor are not bridged, and the capacitor isin a normal state, as illustrated by the area 44.

FIG. 5 shows a schematic representation of an exemplary connection stateof capacitors. In the example shown in FIG. 5, the nude chip includeseight capacitors C1, C2, C3, C4, C5, C6, C7 and C8. As the size ofconductive particles is randomly distributed, two bridges includingbridge 1 and bridge 2 are formed. As a result, C1 and C7 are bridged,and C2, C3, C4, C5, C6 and C8 are in a normal capacitor state. Theconnection state of the capacitors is random and physically unclonable,which can constitute a random password.

In one embodiment, a 64-bit password is taken as an example. Forexample, each PA opening represents one bit of the password and theprobability of the PA opening in an open circuit or a short circuit is50%. The total number of permutations for 64 openings being in an opencircuit or a short circuit is 2⁶⁴, which means that the password couldhave 2⁶⁴ possibilities. In such a way, the security of the physicalunclonable function (PUF) chip is increased. The number of bits of thepassword herein is only for illustrative purpose without limitation. Inone embodiment, the password may have any number of bits other than 64,and PA openings and electrode plate arrays may be formedcorrespondingly.

In S15, the nude chip is packaged to obtain the physical unclonablefunction (PUF) chip.

In one embodiment, after packaging the nude chip, the connection stateof the capacitors formed between the adjacent electrode plates in anarbitrary row is detected and the detection result is stored to thestorage unit of the physical unclonable function (PUF) chip.

To improve the anti jamming performance of the chip, the storage unitmay be a nonvolatile memory according to one embodiment of the presentdisclosure.

FIG. 6 illustrates a schematic structural view of the core circuit of achip consistent with the disclosed embodiment. The core circuit of thechip 6 includes a nonvolatile memory 61, a detector 62, and a comparisonunit 63. In one embodiment, the random distribution of the bridgeconnections causes the capacitor to be connected at random. Thecapacitor connection state caused by the conductive particles in thechip package can be detected by the detector 62 in the core circuit ofthe chip 6, and the connection state is output and stored in thenonvolatile memory 61.

During operation, the detector 62 may detect the capacitor connectionstate of the chip caused by conductive particles. The connection stateof two capacitors can be compared by the comparison unit 63 and thecomparison result is output and stored in the nonvolatile memory 61. Insuch a way, whether the physical unclonable function of the chip isdamaged can be detected during the operation of the chip, such that thechip's anti-attack capability is improved. Because the capacitors arerandomly distributed, when the capacitor connection state of a capacitorcircuit is destroyed, the capacitor connection state is unable to beduplicated, and therefore the security of a chip is increased.

As such, an array of spaced electrode plates is simultaneously formedwhile forming top metal connection layer of a nude chip, and adeposition layer is formed on the top metal connection layer, such thatthe deposition layer between two adjacent electrode plates in any row,along with the two electrode plates form a capacitor. Openings areformed in the deposition layer between the electrode plates, havingcircumference tangent to the electrode plates. A conductive coatinglayer including conductive particles with randomly distributed size isformed on the nude chip to make the capacitors randomly connected. Thenude chip may be packaged to provide a physical unclonable function(PUF) chip. The fabrication method in the present disclosure preventschips on the same wafer having the same capacitor connection state.Chips on the same wafer may have a different capacitor connection state,and the security of a chip is enhanced.

FIG. 7 provides a schematic structural view of a physically unclonablefunction (PUF) chip consistent with various disclosed embodiments. Theexemplary PUF chip may include a package substrate 7 and a nude chip 8.The nude chip 8 is formed on the package substrate 7, and the nude chipincludes a top metal connection layer 81, an array of spaced electrodeplates 82, a deposition layer 83, openings 84 and a conductive coatinglayer 85.

The array of spaced electrode plates 82 is formed on the top metalconnection layer 81 of the nude chip 8 and is formed simultaneously withthe top metal connection layer.

The deposition layer 83 is formed on the top metal connection layer 81.

The openings 84 are tangent to each of the two adjacent electrode platesin a row and are formed between the two adjacent electrode plates.

The conductive coating layer 85 is coated on the nude chip 8. Theconductive coating layer 85 includes conductive particles 851 and thesize of the conductive particles 851 is randomly distributed.

In one embodiment, the top metal connection layer 81 of the nude chip 8is exposed by providing a comb-shaped mask pattern on the top metalconnection layer 81 of the nude chip 8, and the array of the spacedelectrode plates 82 is formed on the top metal connection layer 81 ofthe nude chip 8.

In one embodiment, the conductive coating layer 85 is coated at least inthe region of the openings 84.

In one embodiment, the deposition layer 83 is formed between twoadjacent electrode plates in any row by an IMD process.

In one embodiment, the chip may further include a detector (notindicated) and a storage unit (not indicated). The detector isappropriate for detecting the connection state of the capacitors, formedbetween adjacent electrode plates in any row and having the depositionlayer 83 between the two electrode plates. The storage unit is used tostore the detection result detected by the detector.

In one embodiment, the storage unit is a nonvolatile memory. Any otherappropriate storage unit may also be used for storing the detectionresult by those skilled in the art according to their actual needs.

In one embodiment, the electrode plates in the array of spaced electrodeplates 82 have the same size.

In one embodiment, the adjacent electrode plates in any row of the arrayof spaced electrode plates 82 are evenly spaced at equal intervals.

All or a portion of the various processes of the disclosed embodimentsmay be accomplished by a program to control the associated hardware. Thecontrolling program may be stored in a computer readable storage medium,such as ROM, RAM, disk, or disc.

Compared with the conventional method, the fabrication method in thedisclosure is advantageous. In the present disclosure, an array ofspaced electrode plates is simultaneously formed when the top metalconnection layer of the nude chip is formed, and a deposition layer isformed on the top metal connection layer, such that two adjacentelectrode plates in any row and the deposition layer between the twoadjacent electrode plates form a capacitor. Various openings that aretangent to the two electrode plates are then formed on the depositionlayer between the electrode plates. A conductive coating layer includingconductive particles with randomly distributed size is then coated onthe nude chip to make the capacitors randomly connected. The nude chipis packaged to provide a physical unclonable function (PUF) chip. Thefabrication method in the disclosure prevents chips on the same waferhaving the same capacitor connection state, such that chips on the samewafer may have different capacitor connection states and the security ofa chip is enhanced.

Further, by detecting and storing the connection state of the capacitorsin the nude chip, it is possible to verify the physical unclonablefunction of a chip by detecting the connection state of the capacitorsbefore using the chip, thereby improving the anti-attack capability ofthe chips.

Further, the connection state of capacitors is stored in a nonvolatilememory, and the stored connection state of the capacitors can bemaintained while the chip is powered down, such that the anti jammingperformance of the chip can be improved.

The above detailed descriptions only illustrate certain embodiments ofthe disclosed disclosure, and are not intended to limit the scope of thedisclosed disclosure. Those skilled in the art can understand thespecification as whole and technical features in the various embodimentscan be combined into other embodiments understandable to those personsof ordinary skill in the art. Any equivalent or modification thereof,without departing from the spirit and principle of the presentdisclosure, falls within the true scope of the present disclosure.

What is claimed is:
 1. A physical unclonable function (PUF) chip,comprising: a chip with a top metal connection layer; an array of spacedelectrode plates on the top metal connection layer of the chip; adeposition layer, on the top metal connection layer between each twoadjacent electrode plates, wherein an opening is formed between the eachtwo adjacent electrode plates in a row, and each two adjacent electrodeplates are tangential to the opening formed between the two adjacentelectrode plates; a conductive coating layer on the chip, the conductivecoating layer including conductive particles with randomly distributedsize; and a package substrate, packaged with the chip including theconductive coating layer.
 2. The chip according to claim 1, wherein: thearray of spaced electrode plates are comb-shaped.
 3. The chip accordingto claim 1, wherein: the conductive coating layer is coated in a regionof the openings.
 4. The chip according to claim 1, wherein: thedeposition layer is formed between adjacent electrode plates in any rowby an in-mold decoration (IMD) process.
 5. The chip according to claim1, further comprising: a detector, for detecting a connection state of acapacitor, formed by the adjacent electrode plates in a row having thedeposition layer there-between; and a storage unit, for storing adetection result of the PUF chip.
 6. The chip according to claim 5,wherein: the storage unit is a nonvolatile memory. The chip according toclaim 1, wherein: the electrode plates in the array of spaced electrodeplates have a same size.
 8. The chip according to claim 1, wherein: theadjacent electrode plates in any row of the array of spaced electrodeplates are arranged at equal intervals.
 9. The chip according to claim1, wherein: a capacitor formed by the bridged adjacent two electrodeplates is in a bridged capacitor state, and a capacitor formed bynon-bridged adjacent two electrode plates is in a normal capacitorstate.
 10. The chip according to claim 1, wherein: the conductivecoating layer is directly formed in each of the openings in thedeposition layer.
 11. The chip according to claim 1, wherein: thebridged adjacent two electrode plates are electrically connected byconductive particles distributed between the bridged adjacent twoelectrode plates.
 12. The chip according to claim 1, wherein: randomlydistributed bridges are formed between adjacent two electrode plates dueto the randomly distributed size of the conductive particles.